People working in a chip lab.

ASU to be home of national facility for semiconductor advanced packaging

In a critical step forward for America’s efforts to reclaim its place as the global leader in digital technology, the U.S. Commerce Department and Natcast have announced the selection of Arizona as the site of the co-located NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility.

Read more

More news

ASU Events

For the media

 

Discover more

 

Subscribe for news and events sent straight to your inbox Sign up for our newsletter