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100 micron diameter hole etched from the front side of a silicon wafer and aligned to a 1mm diameter hole etched from the back side.

AgCl reference electrode: A 100 micron diameter hole that is etched entirely through a 500 micron thick silicon wafer


The principal collaboration within CBIC is between faculty at ASU and researchers within Dr. Paska Permana’s group at the Carl T. Hayden VA Hospital in downtown Phoenix
(see http://www.southwest.va.gov/phoenix/index.asp)